DYNAMIC-SCALING EXPONENTS AND THE ROUGHENING KINETICS OF GOLD ELECTRODEPOSITS

2020-04-05 19:59:36

dynamic Gold pitting scaling Morphology

责任者: VAZQUEZ, L;SALVAREZZA, RC;HERRASTI, P;OCON, P;VARA, JM;ARVIA, AJ 单位: UNIV AUTONOMA MADRID,CSIC,INST CIENCIA MAT,DEPT FIS APLICADA,E-28049 MADRID,SPAIN.;INST INVEST FIS QUIM TEORICAS & APLICADAS,RA-1900 LA PLATA,ARGENTINA. 来源出处: PHYSICAL REVIEW B, v 52, JUL 15 1995, p 2032- 2037 摘要: The kinetics of gold electrodeposit toughening was studied at the nanometer level by scanning tunneling microscopy (STM) and by using dynamic-scaling theory. Gold electrodeposits were grown at 100 nm s(-1) from the electroreduction of hydrous gold oxide layers. The following dynamic-scaling exponents were obtained: alpha(I)=0.90+/-0.06 and beta(I)=0.31+/-0.08 for L(s)L(sc), where L(s) is the scale length, and L(sc) is a critical length closely related to the average grain size of the electrodeposit measured from STM imaging. Results from dynamic-scaling analysis are consistent with a grain surface smoothing mechanism involving surface diffusion of gold atoms. 关键词: ANISOTROPIC PITTING; CHLORIDE SOLUTIONS; PASSIVITY; PIT INITIATION; PIT MORPHOLOGY; PITTING POTENTIAL MORPHOLOGY; PITTING POTENTIAL; GROWTH