Application of micromachining in the PLC optical splitter packaging

2020-01-08 07:05:25

loss optical laser femtosecond dependent

责任者: Byoung-Chan Choi;Man-Seop Lee;Ji-Hoon Choi;Chan-Sik Park 单位: ICU Opt. Network & Syst. Lab., Daejeon, South Korea 来源出处: Journal of the Optical Society of Korea(J. Opt. Soc. Korea (South Korea)),Sept. 2003,7(3):166-73 摘要: This paper presents micromachining results on planar-lightwave-circuit (PLC) chips with Si substrate and the quartz substrate by using Ti:sapphire femtosecond-pulsed laser. The ablation process with femtosecond laser pulses generates nothing of contamination, molten zone, microcracks, shock wave, delamination and recast layer. We also showed that the micromachine for PLC using femtosecond pulsed lasers is superior to that using nanosecond pulsed lasers. The insertion loss and the optical return loss of the 1 × 8 optical power slitters packaged with micromachined input- and output-port U-grooves were less than 11.0 dB and more than 55 dB, respectively. The wavelength dependent loss (WDL) was distributed within ± 0.6 dB and the polarization dependent loss (PDL) was less than 0.2 dB 关键词: elemental semiconductors;high-speed optical techniques;integrated optoelectronics;laser ablation;laser beam machining;light polarisation;micromachining;micromechanical devices;optical fabrication;optical losses;optical planar waveguides;solid lasers;micromachining;PLC optical splitter packaging;planar-lightwave-circuit chips;Si substrate;quartz substrate;Ti:sapphire femtosecond-pulsed laser;ablation process;femtosecond laser pulses;contamination;molten zone;microcracks;shock wave;delamination;recast layer;micromachine;insertion loss;optical return loss;optical power slitters;output-port U-grooves;input-port U-grooves;wavelength dependent loss;polarization dependent loss;Al2O3:Ti;Si