Colloidal processing of polymer ceramic nanocomposite integral capacitors

2019-12-24 01:05:49

high processing ceramic polymer capacitors

责任者: Windlass, H.;Raj, P.M.;Balaraman, D.;Bhattacharya, S.K.;Tummala, R.R. 单位: Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA 来源出处: IEEE Transactions on Electronics Packaging Manufacturing(IEEE Trans. Electron. Packag. Manuf. (USA)),2003/04/,26(2):100-5 摘要: Polymer ceramic composites form a suitable material system for low temperature fabrication of embedded capacitors appropriate for the MCM-L technology. Improved electrical properties such as permittivity can be achieved by efficient filling of polymers with high dielectric constant ceramic powders such as lead magnesium niobate-lead titanate (PMN-PT) and barium titanate (BT). Photodefinable epoxies as the matrix polymer allow fine feature definition of the capacitor elements by conventional lithography techniques. The optimum weight percent of dispersant is tuned by monitoring the viscosity of the suspension. The dispersion mechanism (steric and electrostatic contribution) in a slightly polar solvent such as propylene glycol methyl ether acetate (PGMEA) is investigated from electrophoretic measurements. A high positive zeta potential is observed in the suspension, which suggests a strong contribution of electrostatic stabilization. By optimizing the particle packing using a bimodal distribution and modified processing methodology, a dielectric constant greater than 135 was achieved in PMN-PT/epoxy system. Suspensions are made with the lowest PGMEA content to ensure the efficiency of the dispersion and efficient particle packing in the dried film. Improved colloidal processing of nanoparticle-filled epoxy is a promising method to obtain ultra-thin capacitor films (<2μm) with high capacitance density and improved yield. Capacitance of 35 nF/cm2 was achieved with the thinnest films (2.5-3.0 μm) 关键词: ceramic capacitors;colloids;dielectric thin films;electrostatics;filled polymers;integrated circuit manufacture;multichip modules;nanocomposites;permittivity;powders;stability;thin film capacitors;colloidal processing;polymer ceramic nanocomposite;polymer ceramic integral capacitors;low temperature fabrication;embedded capacitors;MCM-L technology;permittivity;electrical properties;high dielectric constant ceramic powders;PMN-PT;photodefinable epoxies;matrix polymer;conventional lithography techniques;propylene glycol methyl ether acetate;PGMEA;electrophoretic measurements;high positive zeta potential;electrostatic stabilization;particle packing;bimodal distribution;modified processing methodology;PMN-PT/epoxy system;nanoparticle-filled epoxy;ultra-thin capacitor films;high capacitance density;2.5 to 3.0 micron;PbMnNbO3;PbTiO3;BaTiO3