Electrodeposition of copper and cobalt nanostructures using self-assembled monol

2019-09-11 19:57:26

Deposition SAMS copper electrochemical cobalt

责任者: Volkel, Berthold;Kaltenpoth, Gisela;Handrea, Marlene;Sahre, Mario;Nottbohm, Christoph T.;Kuller, Alexander;Paul, Anne;Kautek, Wolfgang;Eck, Wolfgang;G 单位: Fakultat fur Physik, Universitat Bielefeld, D-33615 Bielefeld, Germany 来源出处: Surface Science,2005,597(1-3):32-41 摘要: Selective copper and cobalt deposition on e-beam patterned thiol self-assembled monolayers (SAMs) was studied. Gold electrodes were coated with 1-octadecanethiol (CH3-(CH2)17-SH, ODT) and 1,1 prime -biphenyl-4-thiol (C6H5-C6H 4-SH, BPT) and patterned by e-beam lithography and proximity printing using stencil masks and 300 eV electrons. Electron impact caused ODT-SAMs to lose molecular order and BPT SAMs to cross-link. In both cases the electron induced changes have a distinct influence on the electrochemical properties, which allows selective metal deposition. Selectivity is only achieved within a relatively narrow potential range which depends on the SAM type and the electrolyte. By optimizing the deposition parameters we obtained for copper and cobalt deposition a resolution of about 30 nm for single lines and 50 nm in the fabrication of line gratings. For highest resolution a small proximity effect has to be taken in account. © 2005 Elsevier B.V. All rights reserved. 关键词: Nanostructured materials;Electrodeposition;Copper;Cobalt;Monolayers;Self assembly;Electrochemical electrodes;Crosslinking;Aromatic compounds;Paraffins;Electrochemical methods;Metal deposition;Line gratings;Electron impact