Thermal stress hardening of a-Si3N4/nc-TiN nanostructured multilayers

2019-07-04 02:34:09

The stress Si3N4 Japan multilayers

责任者: Xu, Junhua;Yu, Lihua;Azuma, Yasushi;Fujimoto, Toshiyuki;Umehara, Hiroyuki;Kojima, Isao 单位: Materials Characterization Division, Natl. Metrology Institute of Japan, National Institute of AIST, Tsukuba, Ibaraki 305-8565, Japan 来源出处: Applied Physics Letters,2002,81(22):4139-4141 摘要: The effects of deposition temperature, modulation period and the layer thickness of a-Si3N4/nc-TiN nanostructured multilayers was studied. The compressive stresses were found to decrease with increasing layer thickness ratio. The results showed that the alternating stress fields were caused by mismatch of the thermal expansion coefficients. 关键词: Nanostructured materials;Silicon nitride;Titanium nitride;Thermal stress;Amorphous materials;Multilayers;Nanostructured multilayers